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BY25Q256FSEIG(R) Tech Specifications

Bourns  BY25Q256FSEIG(R) technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (8x6)
Mfr BYTe Semiconductor
Memory Types Non-Volatile
Packaging Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C (TA)
Part Status Active
Voltage - Supply 2.7V ~ 3.6V
Memory Size 256Mbit
Clock Frequency 100 MHz
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Write Cycle Time - Word, Page 50µs, 2.4ms
Memory Organization 32M x 8
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BY25Q256FSEIG(R) Documents

Download datasheets and manufacturer documentation for   BY25Q256FSEIG(R)

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