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PEX8696-AA50RBC F Tech Specifications

Broadcom  PEX8696-AA50RBC F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Surface Mount YES
Supplier Device Package 1156-FCBGA (35x35)
Operating Temperature (Max.) 85°C
Operating Temperature (Min.) -5°C
Packaging Tray
Series ExpressLane™
Published 2017
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Applications PCI Express®
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1156
Supply Voltage-Max (Vsup) 1.05V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 0.95V
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, PCI
Bus Compatibility I2C; SMBUS; SPI; USB
Features Configurable
Drive Interface Standard IEEE 1149.6; IEEE 1149.1
Length 35mm
Height Seated (Max) 2.85mm
Width 35mm
RoHS Status RoHS Compliant
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PEX8696-AA50RBC F Documents

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