- Integrated Circuits (ICs)
- Interface - Telecom
- BCM56272A0IFEBG
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Mult. : 1
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BCM56272A0IFEBG
Broadcom BCM56272A0IFEBG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lead Free Status / RoHS Status | -- | |
| Factory Pack QuantityFactory Pack Quantity | 833 | |
| Manufacturer | Broadcom Limited | |
| Brand | Broadcom / Avago | |
| RoHS | Details | |
| Package | Tray | |
| Mfr | Broadcom Limited | |
| Product Status | Active | |
| Series | 110 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | -- | |
| Connector Type | DIP to Cable | |
| Number of Positions | 24Positions | |
| Color | Multiple, Ribbon | |
| Number of Rows | 2Rows | |
| Subcategory | Wireless & RF Integrated Circuits | |
| Technology | Si | |
| Shielding | Unshielded | |
| Contact Finish | Gold | |
| Cable Termination | Solder | |
| Usage | -- | |
| Pitch - Connector | 0.100 (2.54mm) | |
| Pitch - Cable | 0.050 (1.27mm) | |
| Product Type | RF System on a Chip - SoC | |
| Features | -- | |
| Product Category | RF System on a Chip - SoC | |
| Length | 3.00 (914.40mm) | |
| Contact Finish Thickness | 10.0µin (0.25µm) |
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