Bourns Inc TISP61060P Telecom Interface ICs DUAL
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TISP61060P Tech Specifications
Bourns TISP61060P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 8Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | BOURNS INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Pin Count | 8 | |
| JESD-30 Code | R-PDIP-T8 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 5.08 mm | |
| Telecom IC Type | SURGE PROTECTION CIRCUIT | |
| Length | 9.5 mm | |
| Width | 7.62 mm |
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