Bourns Inc TISP61060D Telecom Interface ICs DUAL
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TISP61060D Tech Specifications
Bourns TISP61060D technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 8Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | BOURNS INC | |
| Part Package Code | SOIC | |
| Package Description | SOP, | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Pin Count | 8 | |
| JESD-30 Code | R-PDSO-G8 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Seated Height-Max | 1.75 mm | |
| Telecom IC Type | SURGE PROTECTION CIRCUIT | |
| Length | 4.9 mm | |
| Width | 3.905 mm |
TISP61060D Documents
Download datasheets and manufacturer documentation for TISP61060D
- DatasheetsBOURS06643-1.pdf
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