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0813-1X1T-57-F Tech Specifications

Bel Fuse Inc  0813-1X1T-57-F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 14 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Module
Housing Material Polybutylene Terephthalate (PBT)
Shield Material Copper Alloy
Contact Materials Copper Alloy
Operating Temperature 0°C~70°C
Packaging Tray
Series MagJack®
Published 2006
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Connector Type RJ45
Applications 10/100 Base-T, AutoMDIX, Power over Ethernet (PoE)
Pitch 2.03mm
Orientation 90° Angle (Right)
Shielding Shielded, EMI Finger
Depth 30.48mm
Number of Positions Loaded 8Positions Loadeds
Contact Finish Gold
Number of Ports 1Port
LED Color Does Not Contain LED
Tab Direction Down
Number of Cores per Jack 6Cores per Jacks
Features Board Guide
Length 16.79mm
Width 16.79mm
Contact Finish Thickness 50.0μin 1.27μm
Height Above Board 0.538 13.66mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
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0813-1X1T-57-F Documents

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