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48-6570-10 Tech Specifications

Aries Electronics  48-6570-10 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 5 Weeks
Mounting Type Through Hole
Mount Through Hole
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 48 (2 x 24)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Tin
Operating Temperature (Max.) 105°C
Published 2007
Series 57
Packaging Bulk
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
Number of Positions 48Positions
Additional Feature STANDARD: UL 94V-0
Terminal Pitch 2.54mm
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 2.99 inch
Number of Contacts 48Contacts
PCB Contact Pattern RECTANGULAR
Body Breadth 0.9 inch
Lead Length 2.794mm
Body Depth 0.47 inch
Contact Style SQ PIN-SKT
Insulation Resistance 1000000000Ohm
Mating Contact Pitch 0.1 inch
Dielectric Withstanding Voltage 1000VAC V
PCB Contact Row Spacing 0.6 mm
Termination Post Length 0.110 2.78mm
Pitch - Post 0.100 2.54mm
Features Closed Frame
Contact Finish Thickness - Mating 200.0μin 5.08μm
Contact Finish Thickness - Post 200.0μin 5.08μm
RoHS Status ROHS3 Compliant
Material Flammability Rating UL94 V-0
Flammability Rating UL94 V-0
Lead Free Lead Free
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