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36-3575-18 Tech Specifications

Aries Electronics  36-3575-18 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 6 Weeks
Mounting Type Through Hole
Mount Through Hole
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 36 (2 x 18)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Tin
Published 2007
Series 57
Packaging Bulk
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing
Number of Positions 36Positions
Additional Feature UL 94V-0
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Number of Contacts 36Contacts
Lead Length 2.794mm
Termination Post Length 0.110 2.78mm
Pitch - Post 0.100 2.54mm
Features Closed Frame
Contact Finish Thickness - Mating 200.0μin 5.08μm
Contact Finish Thickness - Post 200.0μin 5.08μm
RoHS Status ROHS3 Compliant
Material Flammability Rating UL94 V-0
Flammability Rating UL94 V-0
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36-3575-18 Documents

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