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28-1518-11H Tech Specifications

Aries Electronics  28-1518-11H technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 5 Weeks
Mount Through Hole
Mounting Type Through Hole
Number of Pins 28Pins
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Packaging Bulk
Series 518
Published 2006
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.2 (5.08mm) Row Spacing
Number of Rows 2Rows
Additional Feature STANDARD: UL 94V-0
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 1.4 inch
Lead Pitch 2.54mm
Number of Contacts 28Contacts
PCB Contact Pattern RECTANGULAR
Lead Length 3.175mm
Body Depth 0.165 inch
Contact Style RND PIN-SKT
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 0.1 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
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28-1518-11H Documents

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