28-1518-10H Tech Specifications

Aries Electronics  28-1518-10H technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 5 Weeks
Mount Through Hole
Mounting Type Through Hole
Number of Pins 28Pins
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Operating Temperature (Max.) 105°C
Packaging Bulk
Series 518
Published 2007
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.2 (5.08mm) Row Spacing
Number of Rows 2Rows
Additional Feature STANDARD: UL 94V-0
Current Rating 3A
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 1.4 inch
Lead Pitch 2.54mm
Number of Contacts 28Contacts
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Lead Length 3.175mm
Body Depth 0.165 inch
Contact Style RND PIN-SKT
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 0.1 mm
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
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28-1518-10H Documents

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