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24-516-11 Tech Specifications

Aries Electronics  24-516-11 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 6 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Contact Finish Mating Gold
Contact Materials Copper
Packaging Bulk
Series 516
Published 2007
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, ZIF (ZIP)
Number of Rows 2Rows
Additional Feature UL STANDARD: 94V-0
Current Rating (Amps) 1A
Pitch - Mating 0.100 2.54mm
Lead Pitch 2.54mm
Number of Contacts 24Contacts
Termination Post Length 0.150 3.81mm
Pitch - Post 0.100 2.54mm
Features Closed Frame
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
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24-516-11 Documents

Download datasheets and manufacturer documentation for   24-516-11

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