20-6621-30 Tech Specifications

Aries Electronics  20-6621-30 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 5 Weeks
Mount Through Hole
Mounting Type Through Hole, Bottom Entry; Through Board
Number of Pins 20Pins
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Number of Positions or Pins (Grid) 20 (2 x 10)
Contact Material - Mating Phosphor Bronze
Contact Material - Post Phosphor Bronze
Contact Finish Mating Tin
Operating Temperature -55°C~105°C
Packaging Bulk
Series 6621
Published 2007
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Additional Feature STANDARD: UL 94V-0
Current Rating 1.5A
Pitch - Mating 0.100 2.54mm
Body Length or Diameter 1.05 inch
Lead Pitch 2.54mm
Number of Contacts 20Contacts
PCB Contact Pattern RECTANGULAR
Body Breadth 0.9 inch
Lead Length 3.81mm
Body Depth 0.375 inch
Contact Style SQ PIN-SKT
Mating Contact Pitch 0.1 inch
PCB Contact Row Spacing 0.9 mm
Termination Post Length 0.150 3.81mm
Pitch - Post 0.100 2.54mm
Features Closed Frame
Contact Finish Thickness - Mating 200.0μin 5.08μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Flammability Rating UL94 V-0
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20-6621-30 Documents

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