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DIP628-001BLF

Amphenol  DIP628-001BLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Through Hole
Mounting Type Through Hole
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Number of Positions or Pins (Grid) 28 (2 x 14)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Contact Finish Mating Gold
Contact Materials Copper
Insulation Materials Polychlorinated
Packaging Tube
Published 2007
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type DIP, Socket
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Rows 2Rows
HTS Code 8536.69.40.40
Orientation Straight
Depth 17.78mm
Pitch - Mating 0.100 2.54mm
Number of Contacts 28Contacts
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Body Breadth 0.7 inch
Lead Length 3.175mm
Contact Style RND PIN-SKT
Row Spacing 15.24 mm
Mating Contact Pitch 0.1 inch
Termination Post Length 0.125 3.18mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Length 35.56mm
Width 17.8mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 200.0μin 5.08μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0

DIP628-001BLF

Download datasheets and manufacturer documentation for   DIP628-001BLF

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