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DILB8P-223TLF

Amphenol  DILB8P-223TLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 11 Weeks
Contact Plating Tin
Mounting Type Through Hole
Housing Material Polyamide (PA), Nylon
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy
Contact Finish Mating Tin
Operating Temperature -55°C~105°C
Packaging Tube
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Current Rating (Amps) 1A
Pitch - Mating 0.100 2.54mm
Number of Contacts 8Contacts
Contact Finish - Post Tin
Contact Resistance 30mOhm
Termination Post Length 0.124 3.15mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Contact Finish Thickness - Mating 100.0μin 2.54μm
Contact Finish Thickness - Post 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
DILB8P-223TLF brand manufacturers: Amphenol ICC (FCI), Twicea stock, DILB8P-223TLF reference price.Amphenol ICC (FCI). DILB8P-223TLF parameters, DILB8P-223TLF Datasheet PDF and pin diagram description download.You can use the DILB8P-223TLF Sockets for ICs, Transistors, DSP Datesheet PDF, find DILB8P-223TLF pin diagram and circuit diagram and usage method of function,DILB8P-223TLF electronics tutorials.You can download from the Twicea.