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DILB16P-223TLF Tech Specifications

Amphenol  DILB16P-223TLF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 11 Weeks
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Package / Case DIP
Housing Material Polyamide (PA), Nylon
Number of Positions or Pins (Grid) 16 (2 x 8)
Contact Material - Mating Copper Alloy
Contact Material - Post Copper Alloy
Contact Finish Mating Tin
Contact Materials Bronze
Insulation Materials Polyester
Voltage Rated 200V
Operating Temperature -55°C~105°C
Packaging Tube
Published 2006
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type DIP, Socket
Type DIP, 0.3 (7.62mm) Row Spacing
Number of Positions 16Positions
Max Operating Temperature 105°C
Min Operating Temperature -55°C
Number of Rows 2Rows
Gender Female
Current Rating (Amps) 1A
Pitch 2.54mm
Orientation Straight
Depth 10.16mm
Current Rating 1A
Pitch - Mating 0.100 2.54mm
Voltage - Rated AC 200V
Number of Contacts 16Contacts
Contact Finish - Post Tin
Lead Length 3.1496mm
Contact Resistance 30mOhm
Insulation Resistance 500MOhm
Row Spacing 7.62 mm
Termination Post Length 0.124 3.15mm
Pitch - Post 0.100 2.54mm
Features Open Frame
Length 20.32mm
Width 17.78mm
Contact Finish Thickness - Mating 100.0μin 2.54μm
Contact Finish Thickness - Post 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
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DILB16P-223TLF Documents

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