In Stock
:
94 Min. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
MDT850M01501 Tech Specifications
Amphenol MDT850M01501 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Surface Mount, Right Angle | |
| Material - Insulation | Liquid Crystal Polymer (LCP) | |
| Body Orientation | Right Angle | |
| Contact Materials | Copper Alloy | |
| Package | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | |
| Base Product Number | MDT850 | |
| Mfr | Amphenol ICC (FCI) | |
| Product Status | Active | |
| Operating Temperature | -40°C ~ 85°C | |
| Series | M.2 | |
| Termination | Solder | |
| Number of Positions | 75Positions | |
| Color | Black | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Contact Type | - | |
| Pitch | 0.5mm | |
| Contact Finish | Gold | |
| Number of Contacts | 67Contacts | |
| Card Type | M.2 (NGFF) Mini Card | |
| Read Out | Dual | |
| Number of Positions/Bay/Row | - | |
| Flange Feature | - | |
| Features | Board Guide, Solder Retention | |
| Contact Finish Thickness | 30.0µin (0.76µm) | |
| Card Thickness | - |
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ



