- Connectors, Interconnects
- Rectangular Connectors - Board Spacers, Stackers (Board to Board)
- FBBM030V03C13
Min. : 1
Mult. : 1
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FBBM030V03C13
Amphenol FBBM030V03C13 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Package / Case | 0402 (1005 Metric) | |
| Contact Plating | Gold | |
| Supplier Device Package | 0402 | |
| Housing Material | Thermoplastic (TP) | |
| Package | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | |
| Base Product Number | RN73R1E | |
| Mfr | KOA Speer Electronics, Inc. | |
| Product Status | Active | |
| Maximum Operating Temperature | + 125 C | |
| Minimum Operating Temperature | - 40 C | |
| Factory Pack QuantityFactory Pack Quantity | 3600 | |
| Mounting Styles | Board Lock | |
| Contact Materials | Copper Alloy | |
| Manufacturer | Amphenol | |
| Brand | Amphenol Commercial Products | |
| Operating Temperature | -55°C ~ 155°C | |
| Series | RN73R | |
| Packaging | Reel | |
| Size / Dimension | 0.039 L x 0.020 W (1.00mm x 0.50mm) | |
| Tolerance | ±0.25% | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±10ppm/°C | |
| Resistance | 96.5 Ohms | |
| Number of Positions | 30 PositionPosition | |
| Composition | Thin Film | |
| Number of Rows | 2 RowRow | |
| Power (Watts) | 0.063W, 1/16W | |
| Subcategory | Board to Board & Mezzanine Connectors | |
| Pitch | 0.5 mm | |
| Current Rating | 500 mA | |
| Termination Style | Solder | |
| Failure Rate | - | |
| Insulation Resistance | 100 MOhms | |
| Product Type | Board to Board & Mezzanine Connectors | |
| Product | Plugs | |
| Mounting Angle | Vertical | |
| Features | Automotive AEC-Q200, Moisture Resistant | |
| Product Category | Board to Board & Mezzanine Connectors | |
| Height Seated (Max) | 0.016 (0.40mm) | |
| Flammability Rating | UL 94V-0 | |
| Ratings | AEC-Q200 |
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