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DIP640-001B

Amphenol  DIP640-001B technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Contact Plating Gold
Housing Material Polyetheretherketone (PEEK), Glass Filled
Number of Positions or Pins (Grid) 32 (2 x 16)
Contact Material - Mating Beryllium Nickel
Contact Material - Post Beryllium Nickel
Contact Finish Mating Nickel Boron
Body Orientation Straight
Termination Method Solder
Base/Housing Material Polyester
Contact Materials Beryllium Copper
Mounting Through Hole
Operating Temperature -55°C ~ 250°C
Series 55
Packaging Bulk
Part Status Active
Termination Solder
Type DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing
Number of Rows 2Rows
Gender Receptacle
Pitch 2.5400 mm
Current Rating 1A
Pitch - Mating 0.100 (2.54mm)
Pin Count 40
Number of Contacts 40 POSContact
Contact Finish - Post Nickel Boron
Contact Resistance --
Row Spacing 6 mm
Termination Post Length 0.110 (2.78mm)
Pitch - Post 0.100 (2.54mm)
Features Closed Frame
Product Length 48.26 mm
Contact Finish Thickness - Mating 50.0µin (1.27µm)
Contact Finish Thickness - Post 50.0µin (1.27µm)
Material Flammability Rating UL94 V-0
DIP640-001B brand manufacturers: Amphenol, Twicea stock, DIP640-001B reference price.Amphenol. DIP640-001B parameters, DIP640-001B Datasheet PDF and pin diagram description download.You can use the DIP640-001B Sockets for ICs, Transistors, DSP Datesheet PDF, find DIP640-001B pin diagram and circuit diagram and usage method of function,DIP640-001B electronics tutorials.You can download from the Twicea.