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XCZU47DR-L1FFVE1156I

AMD  XCZU47DR-L1FFVE1156I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Material Thermoplastic Rubber
Package Quantity 4000
Maximum Operating Temperature 135 °C
Minimum Operating Temperature -40 °C
Inside Diameter 12.5 mm
Number of I/Os 366I/Os
Package Tray
Mfr AMD
Product Status Active
Operating Temperature -40°C ~ 100°C (TJ)
Series Zynq® UltraScale+™ RFSoC
Type Hole Grommet
Color Black
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Overall Height 6.4 mm
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Flash Size -
Panel Thickness 1.6 mm
XCZU47DR-L1FFVE1156I brand manufacturers: AMD, Twicea stock, XCZU47DR-L1FFVE1156I reference price.AMD. XCZU47DR-L1FFVE1156I parameters, XCZU47DR-L1FFVE1156I Datasheet PDF and pin diagram description download.You can use the XCZU47DR-L1FFVE1156I Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCZU47DR-L1FFVE1156I pin diagram and circuit diagram and usage method of function,XCZU47DR-L1FFVE1156I electronics tutorials.You can download from the Twicea.