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XCZU19EG-3FFVC1760I

AMD  XCZU19EG-3FFVC1760I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 1760Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-1760
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom 0.9 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Terminal Pitch 1 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B1760
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.71 mm
Length 42.5 mm
Width 42.5 mm

XCZU19EG-3FFVC1760I

Download datasheets and manufacturer documentation for   XCZU19EG-3FFVC1760I

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