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XCVU23P-3VSVA1365E Tech Specifications

AMD  XCVU23P-3VSVA1365E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 1365-BFBGA, FCBGA
Supplier Device Package 1365-FCBGA (35x35)
Mated Stacking Heights 4mm
Number of I/Os 364I/Os
Package Tray
Mfr AMD
Product Status Active
Series Free Height (FH) GIGA
Packaging Tape & Reel (TR)
Operating Temperature 0°C ~ 100°C (TJ)
Part Status Obsolete
Connector Type Receptacle, Center Strip Contacts
Number of Positions 40Positions
Number of Rows 2Rows
Pitch 0.024 (0.60mm)
Voltage - Supply 0.873V ~ 0.927V
Contact Finish Gold
Number of Logic Elements/Cells 2252250Logic Elements/Cells
Total RAM Bits 77909197
Number of LABs/CLBs 128700LABs/CLBs
Features Board Guide, Solder Retention
Contact Finish Thickness 8.00µin (0.203µm)
Height Above Board 0.128 (3.25mm)
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