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- 10AX115N3F45E2LG
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10AX115N3F45E2LG Tech Specifications
ALTERA 10AX115N3F45E2LG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Package / Case | 1206 (3216 Metric) | |
| Mounting Type | Surface Mount | |
| Mount | Surface Mount | |
| Surface Mount | YES | |
| Supplier Device Package | 1206 | |
| Number of Terminals | 1932Terminals | |
| Package | Tape & Reel (TR) | |
| Mfr | KOA Speer Electronics, Inc. | |
| Product Status | Active | |
| Number of I/Os | 768I/Os | |
| RoHS | Compliant | |
| Moisture Sensitive | Yes | |
| Shipping Restrictions | This product may require additional documentation to export from the United States. | |
| Number of Logic Elements | 1150000 LELogic Element | |
| Supply Voltage-Max | 930 mV | |
| Factory Pack QuantityFactory Pack Quantity | 12 | |
| Supply Voltage-Min | 870 mV | |
| Mounting Styles | SMD/SMT | |
| Number of Logic Array Blocks - LABs | 53400 LABLogic Array Blocks - LAB | |
| Part # Aliases | 967557 | |
| Manufacturer | Intel | |
| Brand | Intel / Altera | |
| Tradename | Arria 10 FPGA | |
| Package Description | BGA, BGA1932,44X44,40 | |
| Package Style | GRID ARRAY | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA1932,44X44,40 | |
| Supply Voltage-Nom | 0.9 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 100 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | 10AX115N3F45E2LG | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Risk Rank | 5.38 | |
| Operating Temperature | -55°C ~ 155°C | |
| Series | SG73G | |
| Packaging | Tray | |
| Size / Dimension | 0.126 L x 0.063 W (3.20mm x 1.60mm) | |
| Tolerance | ±0.5% | |
| JESD-609 Code | e1 | |
| Part Status | Active | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±50ppm/°C | |
| Resistance | 1.07 kOhms | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Max Operating Temperature | 100 °C | |
| Min Operating Temperature | 0 °C | |
| Composition | Thick Film | |
| Power (Watts) | 0.5W, 1/2W | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Programmable Logic ICs | |
| Technology | CMOS | |
| Voltage - Supply | 0.87 V ~ 0.93 V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B1932 | |
| Number of Outputs | 768Outputs | |
| Qualification Status | Not Qualified | |
| Failure Rate | - | |
| Power Supplies | 0.9 V | |
| Temperature Grade | OTHER | |
| RAM Size | 8.2 MB | |
| Number of Inputs | 768Inputs | |
| Seated Height-Max | 3.65 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Number of Logic Elements/Cells | 1150000Logic Elements/Cells | |
| Product Type | FPGA - Field Programmable Gate Array | |
| Total RAM Bits | 68857856 | |
| Number of LABs/CLBs | 427200LABs/CLBs | |
| Number of Logic Blocks (LABs) | 427200Logic Blocks (LABs)s | |
| Number of Logic Cells | 1150000Logic Cells | |
| Features | Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding | |
| Product Category | FPGA - Field Programmable Gate Array | |
| Height Seated (Max) | 0.028 (0.70mm) | |
| Width | 45 mm | |
| Length | 45 mm | |
| Ratings | - |
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