Advantech BB-ZZ-4AO Miscellaneous Kits Wireless I/O Expansion Module
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BB-ZZ-4AO Tech Specifications
Advantech BB-ZZ-4AO technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Panel Mount, Through Hole | |
| Mounting Feature | Flange | |
| Shell Material | Aluminum | |
| Package | Retail Package | |
| Primary Material | Metal | |
| Mfr | Glenair | |
| Product Status | Active | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Gold | |
| For Use With/Related Products | Zlinx™ Modules | |
| Operating Temperature | -65°C ~ 175°C | |
| Series | 806 | |
| Termination | Solder | |
| Connector Type | Plug, Male Pins | |
| Type | Wireless I/O Expansion Module | |
| Color | Black | |
| Fastening Type | Threaded | |
| Orientation | B | |
| Shell Finish | Black Zinc Nickel | |
| Shell Size - Insert | 23-97 |
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