| Image | Part # | Manufacturer | Description | Availability | Pricing | Quantity | Contact plating | Surface Mount | Number of pins | Number of Terminals | Access Time-Max | Category | Clock Frequency-Max (fCLK) | Connector | Connector pinout layout | Contacts pitch | Electrical mounting | Gross weight | Ihs Manufacturer | Kind of connector | Manufacturer | Manufacturer Part Number | Number of Words | Number of Words Code | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Row pitch | Spatial orientation | Supply Voltage-Nom (Vsup) | Type of connector | Operating temperature | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Current rating | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Rated voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Sequential Burst Length | Interleaved Burst Length | Access Mode | Profile | Self Refresh | Length | Width | Plating thickness | Flammability rating |
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  | Mfr. Part #H5AN8G8NDJR-XNCTwicea Part #16700-535-H5AN8G8NDJR-XNC | HYNIX |
Description: DDR4 DRAM, 1GX8, CMOS, PBGA78, FBGA-78
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| 12800
In Stock
| Min.:1 Mult.:1 | gold-plated | YES | 20 | 78 | - | Integrated Circuits (ICs)/Memory/Memory (ICs) | 1600 MHz | socket | 2x10 | 2.54mm | THT | 1.1 g | SK HYNIX INC | female | - | - | 1073741824 words | 1000000000 | 85 °C | FBGA-78(7.5x11) | PLASTIC/EPOXY | TFBGA | FBGA-78 | BGA78,9X13,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | End Of Life | - | - | - | Yes | 2.54mm | straight | 1.2 V | pin strips | -40...163°C | - | - | EAR99 | - | - | AUTO/SELF REFRESH | 8542.32.00.36 | - | - | BOTTOM | BALL | - | 1 | 0.8 mm | compliant | 3A | - | R-PBGA-B78 | - | 1.26 V | - | - | 1.14 V | 1 | SYNCHRONOUS | 0.05 mA | 1GX8 | 1.2 mm | 8 | 0.033 A | 8589934592 bit | - | COMMON | DDR4 DRAM | - | 150V | - | - | - | - | - | - | - | 4,8 | 4,8 | MULTI BANK PAGE BURST | beryllium copper | YES | 11 mm | 7.5 mm | 0.75µm | UL94V-0 | |
| H5AN8G8NDJR-XNC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #H5CG48AGBDX018NTwicea Part #16700-535-H5CG48AGBDX018N | HYNIX |
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Datasheet
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| 10000
In Stock
| Min.:1 Mult.:1 | - | - | - | - | - | Integrated Circuits (ICs)/Memory/Memory (ICs) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
| H5CG48AGBDX018N | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #H5AN8G8NCJR-XNCTwicea Part #16700-535-H5AN8G8NCJR-XNC | HYNIX |
8Gbit 1.14V~1.26V 1.6GHz SDRAM DDR4 FBGA-780 Memory (ICs) RoHS
Datasheet
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| Min.:1 Mult.:1 | - | - | - | - | - | Integrated Circuits (ICs)/Memory/Memory (ICs) | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA-780 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| H5AN8G8NCJR-XNC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #HY27US08561A-FPCBTwicea Part #16700-535-HY27US08561A-FPCB | Hynix |
Flash, 32MX8, 30ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, LEAD FREE, FBGA-63
Datasheet
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| 2
In Stock
| Min.:1 Mult.:1 | - | YES | - | 63 | 30 ns | - | - | - | - | - | - | - | SK HYNIX INC | - | SK Hynix Inc | HY27US08561A-FPCB | 33554432 words | 32000000 | 70 °C | - | PLASTIC/EPOXY | VFBGA | VFBGA, BGA63,10X12,32 | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 20 | 5.8 | Yes | - | - | 3.3 V | - | - | e1 | Yes | 3A991.B.1.A | SLC NAND TYPE | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.32.00.51 | Flash Memories | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | - | 63 | R-PBGA-B63 | Not Qualified | 3.6 V | 3/3.3 V | COMMERCIAL | 2.7 V | - | ASYNCHRONOUS | 0.02 mA | 32MX8 | 1 mm | 8 | 0.00005 A | 268435456 bit | PARALLEL | - | FLASH | 3.3 V | - | NO | NO | YES | 2K | 16K | 512 words | YES | - | - | - | - | - | 11 mm | 9 mm | - | - | |
| HY27US08561A-FPCB |
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