KS74HCTLS822N Tech Specifications

Samsung  KS74HCTLS822N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount NO
Number of Terminals 24Terminals
Supply Voltage-Nom (Vsup) 5 V
Package Style IN-LINE
Package Shape RECTANGULAR
Package Equivalence Code DIP24,.3
Package Code DIP
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Moisture Sensitivity Levels 3
Load Capacitance (CL) 50 pF
Package Description DIP, DIP24,.3
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Life Cycle Code Obsolete
Rohs Code No
JESD-609 Code e0
Pbfree Code No
Terminal Finish TIN LEAD
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 10Functions
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
JESD-30 Code R-PDIP-T24
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Output Characteristics 3-STATE
Logic IC Type D FLIP-FLOP
Max I(ol) 0.024 A
Trigger Type POSITIVE EDGE
Max Frequency@Nom-Sup 30000000 Hz
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KS74HCTLS822N Documents

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