- Integrated Circuits (ICs)
- Embedded - System On Chip (SoC)
| Mounting Type | Package / Case | Supplier Device Package | Housing Material | Approvals | Base Product Number | Case Size | Case Style | Connections | Device Logic Units | Display | Manufacturer | Manufacturer Part Number | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Number of I/Os | Number of Outlets | Package | Product Status | Range | Supplier Package | Timing Range | Typical Operating Supply Voltage | Operating Temperature | Series | Termination | Applications | Output | Pin Count | Function | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Coil Voltage | Screening Level | Speed Grade | Primary Attributes | Number of Registers | Flash Size | Mode of Operation | Contacts | IP Rating | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr.XCZU3CG-L2SFVA625ETwicea2937-492-XCZU3CG-L2SFVA625E | AMD |
XCZU3CG-L2SFVA625E
| 623
| Min.:1 Mult.:1 | - | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | - | - | - | - | - | - | - | - | ABB | KA2-2143 | - | - | AMD | - | 180 | - | Tray | Active | - | - | - | - | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | |
| XCZU3CG-L2SFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU11EG-3FFVC1156ETwicea2937-492-XCZU11EG-3FFVC1156E | AMD |
FPGA Zynq UltraScale Family 653100 Cells 20nm Technology 0.9V 1156-Pin FCBGA Tray
| Min.:1 Mult.:1 | Surface | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | - | CSA, UL | XCZU11 | - | - | - | - | - | Amperite | 230C180B | - | 0.927 V | AMD | 0.873 V | 360 | - | Tray | Active | - | - | 180 | 0.9000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 0.110 in Flat Blade | - | - | - | - | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 230 VAC, 230 VDC | - | 3 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | Off Delay | 1NC | - | ||
| XCZU11EG-3FFVC1156E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU3EG-1SFVA625ETwicea2937-492-XCZU3EG-1SFVA625E | AMD |
FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 0.85V 625-Pin FCBGA Tray
| 34
| Min.:1 Mult.:1 | - | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | - | - | XCZU3 | - | - | - | 154,350 | - | Johnson Controls | VH7281GS+8122G | 180 | 0.892 V | AMD | 0.808 V | 180 | - | Tray | Active | - | FCBGA | - | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | - | - | - | 625 | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Extended Industrial | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 141,120 | - | - | - | - | |
| XCZU3EG-1SFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU2CG-L1SFVA625ITwicea2937-492-XCZU2CG-L1SFVA625I | AMD |
FPGA XCZU2CG Family 103320 Logic Units 103320 Cells 16nm Technology 0.72V/0.85V 625-Pin FCBGA Tray
| 2410
| Min.:1 Mult.:1 | - | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | - | - | XCZU2 | - | - | - | - | - | Cutler Hammer, Div of Eaton Corp | DH363FGKV | - | 0.742, 0.892 V | AMD | 0.698, 0.808 V | 180 | - | Tray | Active | - | - | - | 0.72, 0.85 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | - | - | - | 625 | - | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | 1L | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | |
| XCZU2CG-L1SFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU11EG-2FFVC1760ITwicea2937-492-XCZU11EG-2FFVC1760I | AMD |
FPGA Zynq UltraScale Family 653100 Cells 1333MHz 20nm Technology 0.85V 1760-Pin FPBGA Tray
| 838
| Min.:1 Mult.:1 | - | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | - | - | XCZU11 | - | - | - | - | - | Miscellaneous | - | - | - | AMD | - | 512 | - | Tray | Active | - | - | - | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | 2 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | - | |
| XCZU11EG-2FFVC1760I | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU19EG-L2FFVB1517ETwicea2937-492-XCZU19EG-L2FFVB1517E | AMD |
Xilinx Commercial Zynq UltraScale 1143450 System Logic Cells 1045440 CLB Flip-Flops 34.6Mbyte RAM 644 I/O 1V to 3.3V Supply Voltage Quad APU/Dual RPU/Single GPU Surface Mount 1517-Ball FPBGA Tray
| 689
| Min.:1 Mult.:1 | - | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | - | XCZU19 | - | - | - | - | - | Greenlee | 0254-51 | - | - | AMD | - | 644 | - | Tray | Active | - | - | - | - | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | - | |
| XCZU19EG-L2FFVB1517E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU17EG-2FFVD1760ETwicea2937-492-XCZU17EG-2FFVD1760E | AMD |
Xilinx Commercial Zynq UltraScale 926194 System Logic Cells 846806 CLB Flip-Flops Flip-chip with 1.0mm Ball Pitch Extended Temperature 1760-Pin FCBGA Bulk
| 645
| Min.:1 Mult.:1 | - | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | - | - | XCZU17 | - | - | - | - | No Display | Johnson Controls | TE-6100-11 | - | - | AMD | - | 308 | - | Tray | Active | - | - | - | - | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | - | Indoor | 1 kOhm Nickel RTD | - | Temperature | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | - | - | - | - | |
| XCZU17EG-2FFVD1760E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU4CG-1FBVB900ITwicea2937-492-XCZU4CG-1FBVB900I | AMD |
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
| 888
| Min.:1 Mult.:1 | - | 900-BBGA, FCBGA | 900-FCBGA (31x31) | - | - | XCZU4 | - | - | - | - | - | Cutler Hammer, Div of Eaton Co | XTAE080FS1TD5E100 | - | 0.892 V | AMD | 0.808 V | 204 | - | Tray | Active | - | - | - | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | |
| XCZU4CG-1FBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU17EG-2FFVC1760ETwicea2937-492-XCZU17EG-2FFVC1760E | AMD |
Xilinx Commercial Zynq UltraScale 926194 System Logic Cells 846806 CLB Flip-Flops Quad APU/Dual RPU/Single GPU Flip-chip with 1.0mm Ball Pitch Extended Temperature 1760-Pin FCBGA Bulk
| Min.:1 Mult.:1 | - | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | - | - | XCZU17 | - | - | - | - | - | Miscellaneous | - | - | - | AMD | - | 512 | - | Tray | Active | - | - | - | - | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | - | - | - | - | ||
| XCZU17EG-2FFVC1760E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU7EV-3FFVF1517ETwicea2937-492-XCZU7EV-3FFVF1517E | AMD |
FPGA Zynq UltraScale Family 504000 Cells 20nm Technology 0.9V 1517-Pin FCBGA Tray
| 740
| Min.:1 Mult.:1 | - | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | - | XCZU7 | - | - | - | - | No Display | Siemens Building Technologies | QAA1011.AATU | - | 0.927 V | AMD | 0.873 V | 464 | - | Tray | Active | - | - | - | 0.9000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EV | - | Indoor | 1 kOhm Platinum RTD | - | Temperature | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | 3 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | |
| XCZU7EV-3FFVF1517E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU19EG-L1FFVC1760ITwicea2937-492-XCZU19EG-L1FFVC1760I | AMD |
Xilinx Commercial Zynq UltraScale 1143450 System Logic Cells 1045440 CLB Flip-Flops 34.6Mbyte RAM 512 I/O 1V to 3.3V Supply Voltage Quad APU/Dual RPU/Single GPU Surface Mount 1760-Ball FPBGA Tray
| 600
| Min.:1 Mult.:1 | - | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | - | - | XCZU19 | - | - | - | - | - | Cutler Hammer, Div of Eaton Co | MUBADP330 | - | - | AMD | - | 512 | - | Tray | Active | - | - | - | - | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | - | |
| XCZU19EG-L1FFVC1760I | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU11EG-L1FFVC1760ITwicea2937-492-XCZU11EG-L1FFVC1760I | AMD |
Zynq UltraScale MPSoC 653100 Cells 597120 Registers 22124954 Bit RAM 1760-Pin FCBGA Tray
| 688
| Min.:1 Mult.:1 | - | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Aluminum | - | XCZU11 | - | - | - | - | - | Grace Technologies | P-E5P1-M3RF0 | - | - | AMD | - | 512 | (2) GFCI | Tray | Active | - | - | - | - | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | IP65 | |
| XCZU11EG-L1FFVC1760I | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU11EG-1FFVB1517ITwicea2937-492-XCZU11EG-1FFVB1517I | AMD |
FPGA Zynq UltraScale Family 653100 Cells 20nm Technology 0.85V 1517-Pin FCBGA Tray
| Min.:1 Mult.:1 | - | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | - | XCZU11 | - | - | - | - | - | Turck | U-91485 | - | 0.892 V | AMD | 0.808 V | 488 | - | Tray | Active | - | - | - | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | - | ||
| XCZU11EG-1FFVB1517I | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU7EV-L2FBVB900ETwicea2937-492-XCZU7EV-L2FBVB900E | AMD |
IC SOC CORTEX-A53 900FCBGA
| 896
| Min.:1 Mult.:1 | - | 900-BBGA, FCBGA | 900-FCBGA (31x31) | - | - | XCZU7 | - | - | - | - | - | Miscellaneous | - | - | 0.876 V | AMD | 0.825 V | 204 | - | Tray | Active | - | - | - | 0.8500 V | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EV | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | 2L | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | |
| XCZU7EV-L2FBVB900E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU3CG-L2SBVA484ETwicea2937-492-XCZU3CG-L2SBVA484E | AMD |
XCZU3CG-L2SBVA484E
| 884
| Min.:1 Mult.:1 | - | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Aluminum | - | XCZU3 | - | - | - | - | - | Grace Technologies | P-D4-H3R3 | - | - | AMD | - | 82 | (1) 120V Receptacle | Tray | Active | - | - | - | - | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | IP65 | |
| XCZU3CG-L2SBVA484E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU11EG-1FFVB1517ETwicea2937-492-XCZU11EG-1FFVB1517E | AMD |
FPGA Zynq UltraScale Family 653100 Cells 20nm Technology 0.85V 1517-Pin FCBGA Tray
| 898
| Min.:1 Mult.:1 | - | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | - | XCZU11 | - | - | - | - | - | Turck | RSM40RKM50-10M/S1587/BL67 | - | 0.892 V | AMD | 0.808 V | 488 | - | Tray | Active | - | - | - | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | - | |
| XCZU11EG-1FFVB1517E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XAZU3EG-L1SFVC784ITwicea2937-492-XAZU3EG-L1SFVC784I | AMD |
IC SOC CORTEX-A53 784FCBGA
| Min.:1 Mult.:1 | - | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | - | - | XAZU3 | - | - | - | - | - | Murrelektronik | 7000-08701-3170750 | - | 0.742 V | AMD | 0.698 V | 128 | - | Tray | Active | - | - | - | 0.7200 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | - | - | 1L | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | ||
| XAZU3EG-L1SFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU9EG-3FFVB1156ETwicea2937-492-XCZU9EG-3FFVB1156E | AMD |
FPGA Zynq UltraScale Family 599550 Cells 20nm Technology 0.9V 1156-Pin FCBGA Tray
| 842
| Min.:1 Mult.:1 | - | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | - | - | XCZU9 | - | - | - | - | - | Bridgeport Fittings Inc | - | - | 0.927 V | AMD | 0.873 V | 328 | - | Tray | Active | - | - | - | 0.9000 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | 3 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | |
| XCZU9EG-3FFVB1156E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU7CG-2FFVF1517ETwicea2937-492-XCZU7CG-2FFVF1517E | AMD |
Xilinx Commercial Zynq UltraScale FPGA 504000 System Logic Cells 460800 CLB Flip-Flops 11Mb RAM 464 I/O Surface Mount 1517-Ball FPBGA Extended Temperature Tray
| Min.:1 Mult.:1 | - | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | - | XCZU7 | - | - | - | - | - | Murrelektronik | M1D458FRRJ45BM-1M | - | - | AMD | - | 464 | - | Tray | Active | - | - | - | - | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | - | - | - | - | - | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | ||
| XCZU7CG-2FFVF1517E | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr.XCZU11EG-L1FFVF1517ITwicea2937-492-XCZU11EG-L1FFVF1517I | AMD |
Zynq UltraScale MPSoC 653100 Cells 597120 Registers 22124954 Bit RAM 1517-Pin FCBGA Tray
| 511
| Min.:1 Mult.:1 | - | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | - | XCZU11 | 4 | Center Back Mount | 1/2 NPT | - | - | NOSHOK | 40-410-30-vac/bar | - | - | AMD | - | 464 | - | Tray | Active | -30 Hg-0 psi | - | - | - | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | - | |
| XCZU11EG-L1FFVF1517I |
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