Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page48

Integrated Circuits (ICs)
Embedded - System On Chip (SoC)

						Mounting Type	Package / Case	Supplier Device Package	Surface Mount Land Size	Antenna Connector Type	Base Product Number	Brand	Cable Types	Case Code - in	Case Code - mm	Center Frequency	Factory Pack QuantityFactory Pack Quantity	Lifetime @ Temp.	Manufacturer	Maximum Operating Temperature	Mechanical Style	Mfr	Minimum Operating Temperature	Mounting Styles	Number of I/Os	Package	Part # Aliases	Product Status	Protocol - Sub GHz	Protocol - WiFi - 802.11	RoHS	Unit Weight	Voltage Rated	Operating Temperature	Packaging	Series	Size / Dimension	Tolerance	Termination	Temperature Coefficient	Type	Resistance	Applications	Capacitance	Subcategory	Power Rating	Technology	Style	Termination Style	ESR (Equivalent Series Resistance)	Lead Spacing	Polarization	Impedance	Speed	RAM Size	Core Processor	Ripple Current @ High Frequency	Peripherals	Connectivity	Architecture	Product Type	Gain	Primary Attributes	Number of Bands	Flash Size	Product	Product Category	Height	Height Seated (Max)	Length	Width	Ratings
	Mfr. XC7Z035-2FFG900E Twicea 2937-492-XC7Z035-2FFG900E	AMD	FPGA Zynq-7000 275000 Cells 28nm Technology 1V 900-Pin FC-BGA	799	Min.:1 Mult.:1	-	900-BBGA, FCBGA	900-FCBGA (31x31)	-	-	XC7Z035	-	-	-	-	-	-	-	-	-	-	AMD	-	-	130	Tray	-	Active	-	-	-	-	-	0°C ~ 100°C (TJ)	-	Zynq®-7000	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	800MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	-	Kintex™-7 FPGA, 275K Logic Cells	-	-	-	-	-	-	-	-	-
XC7Z035-2FFG900E 2937-492-XC7Z035-2FFG900E AMD : : - : 799 1 : -
	Mfr. XCVM1302-2LSEVSVD1760 Twicea 2937-492-XCVM1302-2LSEVSVD1760	AMD	XCVM1302-2LSEVSVD1760		Min.:1 Mult.:1	-	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	402	Tray	-	Active	-	-	-	-	-	0°C ~ 100°C (TJ)	-	Versal™ Prime	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ Prime FPGA, 70k Logic Cells	-	-	-	-	-	-	-	-	-
XCVM1302-2LSEVSVD1760 2937-492-XCVM1302-2LSEVSVD1760 AMD : : - : - 1 : -
	Mfr. XCVC1902-1MSIVIVA1596 Twicea 2937-492-XCVC1902-1MSIVIVA1596	AMD	Adaptive Compute Acceleration Platform 984MHz 0.8V 1596-Pin BGA	620	Min.:1 Mult.:1	-	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	500	Tray	-	Active	-	-	-	-	-	-40°C ~ 100°C (TJ)	-	Versal™ AI Core	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ AI Core FPGA, 1.9M Logic Cells	-	-	-	-	-	-	-	-	-
XCVC1902-1MSIVIVA1596 2937-492-XCVC1902-1MSIVIVA1596 AMD : : - : 620 1 : -
	Mfr. XCZU1EG-2SBVA484I Twicea 2937-492-XCZU1EG-2SBVA484I	AMD	SoC 64-Bit ARM Cortex-A53/ARM Cortex-R5F RISC 1333MHz/533MHz/600MHz 7 Core 484-Pin FCBGA	2449	Min.:1 Mult.:1	-	484-BFBGA, FCBGA	484-FCBGA (19x19)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	-	Tray	-	Active	-	-	-	-	-	-40°C ~ 100°C (TJ)	-	Zynq® UltraScale+™ MPSoC EG	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	533MHz, 600MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	DMA, WDT	-	MPU, FPGA	-	-	-	-	-	-	-	-	-	-	-	-
XCZU1EG-2SBVA484I 2937-492-XCZU1EG-2SBVA484I AMD : : - : 2449 1 : -
	Mfr. XCVM1802-2LSEVFVC1760 Twicea 2937-492-XCVM1802-2LSEVFVC1760	AMD	Adaptive Compute Acceleration Platform 1968400 Logic Cells 0.7V 1070MHz 1760-Pin BGA	945	Min.:1 Mult.:1	-	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	500	Tray	-	Active	-	-	-	-	-	0°C ~ 100°C (TJ)	-	Versal™ Prime	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ Prime FPGA, 1.9M Logic Cells	-	-	-	-	-	-	-	-	-
XCVM1802-2LSEVFVC1760 2937-492-XCVM1802-2LSEVFVC1760 AMD : : - : 945 1 : -
	Mfr. XCVM1302-1MSINSVF1369 Twicea 2937-492-XCVM1302-1MSINSVF1369	AMD	XCVM1302-1MSINSVF1369		Min.:1 Mult.:1	-	1369-BFBGA	1369-BGA (35x35)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	316	Tray	-	Active	-	-	-	-	-	-40°C ~ 100°C (TJ)	-	Versal™ Prime	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ Prime FPGA, 70k Logic Cells	-	-	-	-	-	-	-	-	-
XCVM1302-1MSINSVF1369 2937-492-XCVM1302-1MSINSVF1369 AMD : : - : - 1 : -
	Mfr. XCVM1402-1LLINBVB1024 Twicea 2937-492-XCVM1402-1LLINBVB1024	AMD	XCVM1402-1LLINBVB1024		Min.:1 Mult.:1	-	1024-BFBGA	1024-BGA (31x31)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	424	Tray	-	Active	-	-	-	-	-	-40°C ~ 100°C (TJ)	-	Versal™ Prime	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ Prime FPGA, 1.2M Logic Cells	-	-	-	-	-	-	-	-	-
XCVM1402-1LLINBVB1024 2937-492-XCVM1402-1LLINBVB1024 AMD : : - : - 1 : -
	Mfr. XCVC1902-2MSEVSVD1760 Twicea 2937-492-XCVC1902-2MSEVSVD1760	AMD	Adaptive Compute Acceleration Platform 1070MHz 0.8V 1760-Pin BGA	830	Min.:1 Mult.:1	-	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	692	Tray	-	Active	-	-	-	-	-	0°C ~ 100°C (TJ)	-	Versal™ AI Core	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ AI Core FPGA, 1.9M Logic Cells	-	-	-	-	-	-	-	-	-
XCVC1902-2MSEVSVD1760 2937-492-XCVC1902-2MSEVSVD1760 AMD : : - : 830 1 : -
	Mfr. XCVC1902-1MSEVSVD1760 Twicea 2937-492-XCVC1902-1MSEVSVD1760	AMD	Adaptive Compute Acceleration Platform 984MHz 0.8V 1760-Pin BGA	602	Min.:1 Mult.:1	-	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	692	Tray	-	Active	-	-	-	-	-	0°C ~ 100°C (TJ)	-	Versal™ AI Core	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ AI Core FPGA, 1.9M Logic Cells	-	-	-	-	-	-	-	-	-
XCVC1902-1MSEVSVD1760 2937-492-XCVC1902-1MSEVSVD1760 AMD : : - : 602 1 : -
	Mfr. XC7Z015-1CLG485C Twicea 2937-492-XC7Z015-1CLG485C	AMD	IC SOC CORTEX-A9 667MHZ 485CSBGA	2418	Min.:1 Mult.:1	Through Hole	Radial, Can	485-CSPBGA (19x19)	-	-	XC7Z015	-	-	-	-	-	-	5000 Hrs @ 105°C	-	-	-	EPCOS - TDK Electronics	-	-	130	Bulk	-	Obsolete	-	-	-	-	25 V	-55°C ~ 105°C	-	B41858	0.492 Dia (12.50mm)	±20%	-	-	-	-	Automotive	2200 µF	-	-	-	-	-	30mOhm @ 10kHz	0.197 (5.00mm)	Polar	25 mOhms	667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	2.858 A @ 100 kHz	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	-	Artix™-7 FPGA, 74K Logic Cells	-	-	-	-	-	1.654 (42.00mm)	-	-	-
XC7Z015-1CLG485C 2937-492-XC7Z015-1CLG485C AMD : : - : 2418 1 : -
	Mfr. XC7Z020-2CLG484I Twicea 2937-492-XC7Z020-2CLG484I	AMD	IC SOC CORTEX-A9 766MHZ 484BGA	40	Min.:1 Mult.:1	-	484-LFBGA, CSPBGA	484-CSPBGA (19x19)	-	-	093338	-	-	-	-	-	-	-	-	-	-	Molex	-	-	130	Bulk	-	Active	-	-	-	-	-	-40°C ~ 100°C (TJ)	-	*	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	766MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	-	Artix™-7 FPGA, 85K Logic Cells	-	-	-	-	-	-	-	-	-
XC7Z020-2CLG484I 2937-492-XC7Z020-2CLG484I AMD : : - : 40 1 : -
	Mfr. XC7Z045-1FFG900C Twicea 2937-492-XC7Z045-1FFG900C	AMD	IC SOC CORTEX-A9 667MHZ 900FCBGA	824	Min.:1 Mult.:1	-	900-BBGA, FCBGA	900-FCBGA (31x31)	-	-	DIV40E15	-	-	-	-	-	-	-	-	-	-	TE Connectivity Deutsch Connectors	-	-	130	Bag	-	Active	-	-	-	-	-	0°C ~ 85°C (TJ)	-	*	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	-	Kintex™-7 FPGA, 350K Logic Cells	-	-	-	-	-	-	-	-	-
XC7Z045-1FFG900C 2937-492-XC7Z045-1FFG900C AMD : : - : 824 1 : -
	Mfr. XCZU7EV-1FBVB900I Twicea 2937-492-XCZU7EV-1FBVB900I	AMD	IC SOC CORTEX-A53 900FCBGA	557	Min.:1 Mult.:1	-	900-BBGA, FCBGA	900-FCBGA (31x31)	-	-	XCZU7	-	-	-	-	-	-	-	-	-	-	KEMET	-	-	204	Bulk	-	Obsolete	-	-	-	-	-	-40°C ~ 100°C (TJ)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	-	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	-	-	-	-	-	-	-	-	-
XCZU7EV-1FBVB900I 2937-492-XCZU7EV-1FBVB900I AMD : : - : 557 1 : -
	Mfr. XCVC1702-2LLEVSVA2197 Twicea 2937-492-XCVC1702-2LLEVSVA2197	AMD	IC VERSAL AI-CORE FPGA 2197BGA		Min.:1 Mult.:1	-	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	608	Tray	-	Active	-	-	Yes	-	-	0°C ~ 100°C (TJ)	-	Versal™ AI Core	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ AI Core FPGA, 1M Logic Cells	-	-	-	-	-	-	-	-	-
XCVC1702-2LLEVSVA2197 2937-492-XCVC1702-2LLEVSVA2197 AMD : : - : - 1 : -
	Mfr. XCVM1802-2LLIVSVA2197 Twicea 2937-492-XCVM1802-2LLIVSVA2197	AMD	IC VERSALPRIME ACAP FPGA 2197BGA	822	Min.:1 Mult.:1	-	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	648	Tray	-	Active	-	-	Yes	-	-	-40°C ~ 100°C (TJ)	-	Versal™ Prime	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ Prime FPGA, 1.9M Logic Cells	-	-	-	-	-	-	-	-	-
XCVM1802-2LLIVSVA2197 2937-492-XCVM1802-2LLIVSVA2197 AMD : : - : 822 1 : -
	Mfr. XC7Z007S-2CLG225E Twicea 2937-492-XC7Z007S-2CLG225E	AMD	IC SOC CORTEX-A9 766MHZ 225BGA	22	Min.:1 Mult.:1	-	225-LFBGA, CSPBGA	225-CSPBGA (13x13)	-	-	XC7Z007	TE Connectivity / Laird External Antennas	-	-	-	460 MHz	1	-	TE Connectivity	-	Whip	AMD	-	Magnetic Mount	54	Tray	-	Active	UHF	-	-	-	-	0°C ~ 100°C (TJ)	-	QW	-	-	-	-	Passive Antenna	-	Mobile Antennas	-	Antennas	-	-	Straight with Base	-	-	-	-	-	766MHz	256KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	-	DMA	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	GPS Antennas - GNSS, GLONASS, Galileo, Beidou	Unity	Artix™-7 FPGA, 23K Logic Cells	1 Band	-	Outdoor Antennas	Antennas	-	-	6 in	-	-
XC7Z007S-2CLG225E 2937-492-XC7Z007S-2CLG225E AMD : : - : 22 1 : -
	Mfr. XAZU2EG-1SFVA625Q Twicea 2937-492-XAZU2EG-1SFVA625Q	AMD	IC SOC CORTEX-A53 625FCBGA		Min.:1 Mult.:1	-	625-BFBGA, FCBGA	625-FCBGA (21x21)	-	-	XAZU2	Vishay / Dale	-	0402	1005	-	10000	-	Vishay	+ 155 C	-	AMD	- 55 C	PCB Mount	128	Tray	-	Active	-	-	Details	0.000023 oz	-	-40°C ~ 125°C (TJ)	Reel	RCWE	-	1 %	2 Terminal	200 PPM / C	Thick Film Surface Mount Chip Resistors	80.6 mOhms	Current Sense	-	Resistors	125 mW (1/8 W)	Thick Film	-	SMD/SMT	-	-	-	-	500MHz, 1.2GHz	1.2MB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	DMA, WDT	CANbus, I²C, SPI, UART/USART, USB	MPU, FPGA	Current Sense Resistors	-	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	-	-	Thick Film Resistors	Current Sense Resistors - SMD	0.35 mm	-	1.05 mm	0.55 mm	-
XAZU2EG-1SFVA625Q 2937-492-XAZU2EG-1SFVA625Q AMD : : - : - 1 : -
	Mfr. XCZU15EG-L1FFVB1156I Twicea 2937-492-XCZU15EG-L1FFVB1156I	AMD	IC SOC CORTEX-A53 1156FCBGA	619	Min.:1 Mult.:1	-	1156-BBGA, FCBGA	1156-FCBGA (35x35)	-	-	XCZU15	ITT Cannon	-	-	-	-	25	-	ITT Cannon	-	-	AMD	-	-	328	Tray	132041-0864	Active	-	-	Details	-	-	-40°C ~ 100°C (TJ)	-	PL	-	-	-	-	-	-	-	-	Circular Connectors	-	-	-	-	-	-	-	-	500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Circular Push Pull Connectors	-	Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	-	-	-	Circular Push Pull Connectors	-	-	-	-	-
XCZU15EG-L1FFVB1156I 2937-492-XCZU15EG-L1FFVB1156I AMD : : - : 619 1 : -
	Mfr. XCZU3CG-1SFVC784E Twicea 2937-492-XCZU3CG-1SFVC784E	AMD	IC SOC CORTEX-A53 784FCBGA	2073	Min.:1 Mult.:1	-	784-BFBGA, FCBGA	784-FCBGA (23x23)	-	-	XCZU3	-	-	-	-	-	-	-	-	-	-	AMD	-	-	252	Tray	-	Active	-	-	Non-Compliant	-	-	0°C ~ 100°C (TJ)	-	Zynq® UltraScale+™ MPSoC CG	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	-	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	-	-	-	-	-	-	-	-	-
XCZU3CG-1SFVC784E 2937-492-XCZU3CG-1SFVC784E AMD : : - : 2073 1 : -
	Mfr. XCVC1802-1LSEVSVA2197 Twicea 2937-492-XCVC1802-1LSEVSVA2197	AMD	IC VERSAL AICORE FPGA 2197BGA		Min.:1 Mult.:1	-	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	-	-	-	-	-	-	-	-	-	-	-	-	-	AMD	-	-	770	Tray	-	Active	-	-	-	-	-	0°C ~ 100°C (TJ)	-	Versal™ AI Core	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	400MHz, 1GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	Versal™ AI Core FPGA, 1.5M Logic Cells	-	-	-	-	-	-	-	-	-
XCVC1802-1LSEVSVA2197 2937-492-XCVC1802-1LSEVSVA2197 AMD : : - : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: XC7Z035-2FFG900E,XCVM1302-2LSEVSVD1760,XCVC1902-1MSIVIVA1596,XCZU1EG-2SBVA484I,XCVM1802-2LSEVFVC1760.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134273),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Embedded - System On Chip (SoC) has 1092 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Twicea.

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Twicea

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Integrated Circuits (ICs)