- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
| Factory Lead Time | Operating Temperature | Published | Series | Size / Dimension | Part Status | Moisture Sensitivity Level (MSL) | Connector Type | Speed | RAM Size | Core Processor | Module/Board Type | Flash Size | Co-Processor | RoHS Status | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr.TE0713-02-100-2CTwicea816-487-TE0713-02-100-2C | Trenz Electronic GmbH |
IC MOD ARTIX7 XC7A100T-2F 200MHZ
| Min.:1 Mult.:1 | 12 Weeks | 0°C~70°C | - | TE0713 | 1.57 x 1.97 40mmx50mm | Active | Not Applicable | B2B | 200MHz | 1GB | Artix-7 XC7A100T-2FGG484C | FPGA Core | 32MB | - | - | ||
| TE0713-02-100-2C | |||||||||||||||||||||
![]() | Mfr.TE0803-03-3BE11-ATwicea816-487-TE0803-03-3BE11-A | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | 12 Weeks | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-03-3BE11-A | |||||||||||||||||||||
![]() | Mfr.TE0745-02-45-2IATwicea816-487-TE0745-02-45-2IA | Trenz Electronic GmbH |
IC MODULE CORTEX-A9 1GB 32MB
| Min.:1 Mult.:1 | 12 Weeks | -40°C~85°C | 2018 | TE0745 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | Samtec UFPS | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 32MB | Zynq-7000 (Z-7045) | ROHS3 Compliant | ||
| TE0745-02-45-2IA | |||||||||||||||||||||
![]() | Mfr.TE0745-02-35-1CATwicea816-487-TE0745-02-35-1CA | Trenz Electronic GmbH |
IC MODULE CORTEX-A9 1GB 32MB
| Min.:1 Mult.:1 | 12 Weeks | 0°C~70°C | 2018 | TE0745 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | Samtec UFPS | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 32MB | Zynq-7000 (Z-7035) | - | ||
| TE0745-02-35-1CA | |||||||||||||||||||||
![]() | Mfr.TE0841-02-040-1ITwicea816-487-TE0841-02-040-1I | Trenz Electronic GmbH |
SOM USCALE XCKU040-1S 2GB DDR4
| Min.:1 Mult.:1 | 14 Weeks | -40°C~85°C | - | TE0841 | 1.97 x 1.57 50mmx40mm | Obsolete | 1 (Unlimited) | B2B | - | 512MB | Kintex UltraScale KU40 | FPGA Core | 32MB | - | - | ||
| TE0841-02-040-1I | |||||||||||||||||||||
![]() | Mfr.TE0820-03-03CG-1EDTwicea816-487-TE0820-03-03CG-1ED | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 1GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | - | TE0820 | 1.57 x 1.97 40mmx50mm | Obsolete | Not Applicable | B2B | - | 1GB | Zynq UltraScale+ XCZU3CG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0820-03-03CG-1ED | |||||||||||||||||||||
![]() | Mfr.TE0803-02-04EG-1EATwicea816-487-TE0803-02-04EG-1EA | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4EG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-02-04EG-1EA | |||||||||||||||||||||
![]() | Mfr.TE0820-03-04CG-1EDTwicea816-487-TE0820-03-04CG-1ED | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | - | TE0820 | 1.57 x 1.97 40mmx50mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4CG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0820-03-04CG-1ED | |||||||||||||||||||||
![]() | Mfr.TE0841-02-035-2ITwicea816-487-TE0841-02-035-2I | Trenz Electronic GmbH |
SOM USCALE XCKU035-2S 2GB DDR4
| Min.:1 Mult.:1 | 14 Weeks | -40°C~85°C | - | TE0841 | 1.97 x 1.57 50mmx40mm | Obsolete | 1 (Unlimited) | B2B | - | 2GB | Kintex UltraScale KU035 | FPGA Core | 64MB | - | - | ||
| TE0841-02-035-2I | |||||||||||||||||||||
![]() | Mfr.TE0745-02-30-1IATwicea816-487-TE0745-02-30-1IA | Trenz Electronic GmbH |
IC MODULE CORTEX-A9 1GB 32MB
| Min.:1 Mult.:1 | 12 Weeks | -40°C~85°C | 2018 | TE0745 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | Samtec UFPS | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 32MB | Zynq-7000 (Z-7030) | - | ||
| TE0745-02-30-1IA | |||||||||||||||||||||
![]() | Mfr.TE0820-02-03CG-1EATwicea816-487-TE0820-02-03CG-1EA | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 1GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | - | TE0820 | 1.97 x 1.57 50mmx40mm | Discontinued | - | B2B | - | 1GB | Zynq UltraScale+ XCZU3CG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0820-02-03CG-1EA | |||||||||||||||||||||
![]() | Mfr.TE0803-02-02CG-1EATwicea816-487-TE0803-02-02CG-1EA | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-02-02CG-1EA | |||||||||||||||||||||
![]() | Mfr.TE0803-02-04EV-1EATwicea816-487-TE0803-02-04EV-1EA | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4EV-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-02-04EV-1EA | |||||||||||||||||||||
![]() | Mfr.TE0820-03-02EG-1EDTwicea816-487-TE0820-03-02EG-1ED | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | - | TE0820 | 1.57 x 1.97 40mmx50mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU2EG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0820-03-02EG-1ED | |||||||||||||||||||||
![]() | Mfr.TE0820-03-02CG-1EDTwicea816-487-TE0820-03-02CG-1ED | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | - | TE0820 | 1.57 x 1.97 40mmx50mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0820-03-02CG-1ED | |||||||||||||||||||||
![]() | Mfr.TE0803-03-4BE11-ATwicea816-487-TE0803-03-4BE11-A | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | 12 Weeks | 0°C~85°C | - | TE0803 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4EG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-03-4BE11-A | |||||||||||||||||||||
![]() | Mfr.TE0714-03-50-2ITwicea816-487-TE0714-03-50-2I | Trenz Electronic GmbH |
IC MODULE
| 2651
| Min.:1 Mult.:1 | 12 Weeks | -40°C~85°C | - | TE0714 | 1.18 x 1.57 30mmx40mm | Active | Not Applicable | Samtec LSHM | - | - | Artix-7 A50T | FPGA Core | 16MB | - | ROHS3 Compliant | |
| TE0714-03-50-2I | |||||||||||||||||||||
![]() | Mfr.TE0841-02-32I21-ATwicea816-487-TE0841-02-32I21-A | Trenz Electronic GmbH |
IC MODULE USCALE 2GB
| 876
| Min.:1 Mult.:1 | 12 Weeks | -40°C~85°C | - | TE0841 | 1.97 x 1.57 50mmx40mm | Active | 1 (Unlimited) | B2B | - | 2GB | Kintex UltraScale KU035 | MCU, FPGA | 64MB | - | ROHS3 Compliant | |
| TE0841-02-32I21-A | |||||||||||||||||||||
![]() | Mfr.TE0808-04-BBE21-AKTwicea816-487-TE0808-04-BBE21-AK | Trenz Electronic GmbH |
IC MOD SOM MPSOC 4GB ZU15G
| 695
| Min.:1 Mult.:1 | 12 Weeks | 0°C~85°C | - | TE0808 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | B2B | - | 4GB | Zynq UltraScale+ XCZU15EG-1FFVC900E | MPU Core | 128MB | - | ROHS3 Compliant | |
| TE0808-04-BBE21-AK | |||||||||||||||||||||
![]() | Mfr.TE0808-04-06EG-1EETwicea816-487-TE0808-04-06EG-1EE | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 4GB 128MB
| Min.:1 Mult.:1 | 12 Weeks | 0°C~85°C | - | TE0808 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 4GB | Zynq UltraScale+ XCZU6EG-1FFVC900E | MPU Core | 128MB | - | - | ||
| TE0808-04-06EG-1EE |
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