- Integrated Circuits (ICs)
- Embedded - Microcontroller, Microprocessor, FPGA Modules
| Factory Lead Time | Operating Temperature | Series | Size / Dimension | Part Status | Moisture Sensitivity Level (MSL) | Connector Type | Speed | RAM Size | Core Processor | Module/Board Type | Flash Size | Co-Processor | RoHS Status | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr.TE0803-03-3AE11-ATwicea816-487-TE0803-03-3AE11-A | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | 12 Weeks | 0°C~85°C | TE0803 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU2CG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-03-3AE11-A | ||||||||||||||||||||
![]() | Mfr.TE0745-02-71I11-ATwicea816-487-TE0745-02-71I11-A | Trenz Electronic GmbH |
SOM DDR3 1GB ZYNQ
| Min.:1 Mult.:1 | 12 Weeks | -40°C~85°C | TE0745 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | Samtec ST5 | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | ROHS3 Compliant | ||
| TE0745-02-71I11-A | ||||||||||||||||||||
![]() | Mfr.TE0841-02-41C21-ATwicea816-487-TE0841-02-41C21-A | Trenz Electronic GmbH |
IC MODULE USCALE 2GB
| 757
| Min.:1 Mult.:1 | 12 Weeks | 0°C~70°C | TE0841 | 1.97 x 1.57 50mmx40mm | Active | 1 (Unlimited) | B2B | - | 2GB | Kintex UltraScale KU40 | MCU, FPGA | 64MB | - | ROHS3 Compliant | |
| TE0841-02-41C21-A | ||||||||||||||||||||
![]() | Mfr.TE0841-02-41I21-ATwicea816-487-TE0841-02-41I21-A | Trenz Electronic GmbH |
MOD SOM USCALE 2GB DDR4
| 792
| Min.:1 Mult.:1 | 12 Weeks | -40°C~85°C | TE0841 | 1.97 x 1.57 50mmx40mm | Active | 1 (Unlimited) | B2B | - | 2GB | Kintex UltraScale KU40 | MCU, FPGA | 64MB | - | - | |
| TE0841-02-41I21-A | ||||||||||||||||||||
![]() | Mfr.TE0630-02ITwicea816-487-TE0630-02I | Trenz Electronic GmbH |
IC MOD SPARTAN-6 100MHZ 128MB
| Min.:1 Mult.:1 | 12 Weeks | -40°C~85°C | TE0630 | 1.6 x 1.9 40.5mmx47.5mm | Active | Not Applicable | B2B | 100MHz | 128MB | Spartan-6 LX-45 | FPGA, USB Core | 8MB | Cypress EZ-USB FX2LP | - | ||
| TE0630-02I | ||||||||||||||||||||
![]() | Mfr.TE0725LP-01-72C-1UTwicea816-487-TE0725LP-01-72C-1U | Trenz Electronic GmbH |
IC MOD ARTIX-7 A100T 25MHZ 64MB
| Min.:1 Mult.:1 | 12 Weeks | 0°C~70°C | TE0725 | 2.87 x 1.38 73mmx35mm | Active | 1 (Unlimited) | 50 Pin | 25MHz | - | Artix-7 A100T | FPGA Core | 64MB | - | - | ||
| TE0725LP-01-72C-1U | ||||||||||||||||||||
![]() | Mfr.TE0745-02-71I11-AKTwicea816-487-TE0745-02-71I11-AK | Trenz Electronic GmbH |
IC MOD SOM DDR3L 1GB ZYNQ
| Min.:1 Mult.:1 | 12 Weeks | -40°C~85°C | TE0745 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | Samtec ST5 | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | ROHS3 Compliant | ||
| TE0745-02-71I11-AK | ||||||||||||||||||||
![]() | Mfr.TE0808-04-9GI21-ASTwicea816-487-TE0808-04-9GI21-AS | Trenz Electronic GmbH |
STARTER KIT ZYNQ USCALE ZU9 FPG
| Min.:1 Mult.:1 | 14 Weeks | -40°C~85°C | TE0808 | 2.05 x 2.99 52mmx76mm | Active | Not Applicable | B2B | - | 4GB | Zynq UltraScale+ ZU9 | FPGA Core | 128MB | - | ROHS3 Compliant | ||
| TE0808-04-9GI21-AS | ||||||||||||||||||||
![]() | Mfr.TE0808-04-6BE21-AKTwicea816-487-TE0808-04-6BE21-AK | Trenz Electronic GmbH |
IC MOD SOM MPSOC 4GB ZU6EG
| 808
| Min.:1 Mult.:1 | 12 Weeks | 0°C~85°C | TE0808 | 2.05 x 2.99 52mmx76mm | Active | 1 (Unlimited) | B2B | - | 4GB | Zynq UltraScale+ XCZU6EG-1FFVC900E | MPU Core | 128MB | - | ROHS3 Compliant | |
| TE0808-04-6BE21-AK | ||||||||||||||||||||
![]() | Mfr.TE0803-02-03-1EA-STwicea816-487-TE0803-02-03-1EA-S | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | FPGA Core | 128MB | - | - | ||
| TE0803-02-03-1EA-S | ||||||||||||||||||||
![]() | Mfr.TEC0850-03-15EG1EATwicea816-487-TEC0850-03-15EG1EA | Trenz Electronic GmbH |
IC MODULE
| Min.:1 Mult.:1 | - | - | TEC0850 | - | Obsolete | Not Applicable | CompactPCI Serial Backplane | - | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | MCU, FPGA | 128MB | - | ROHS3 Compliant | ||
| TEC0850-03-15EG1EA | ||||||||||||||||||||
![]() | Mfr.TE0841-02-41I21-LTwicea816-487-TE0841-02-41I21-L | Trenz Electronic GmbH |
IC MODULE
| Min.:1 Mult.:1 | - | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| TE0841-02-41I21-L | ||||||||||||||||||||
![]() | Mfr.TE0803-02-04CG-1EATwicea816-487-TE0803-02-04CG-1EA | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4CG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-02-04CG-1EA | ||||||||||||||||||||
![]() | Mfr.TE0803-02-03EG-1EATwicea816-487-TE0803-02-03EG-1EA | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU3EG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-02-03EG-1EA | ||||||||||||||||||||
![]() | Mfr.TEC0850-03-015EG1ETwicea816-487-TEC0850-03-015EG1E | Trenz Electronic GmbH |
IC MODULE
| Min.:1 Mult.:1 | - | - | TEC0850 | - | Obsolete | Not Applicable | CompactPCI Serial Backplane | - | 8GB | Zynq UltraScale+ XCZU15EG-1FFVB1156E | MCU, FPGA | 128MB | - | ROHS3 Compliant | ||
| TEC0850-03-015EG1E | ||||||||||||||||||||
![]() | Mfr.TE0841-02-31I21-ATwicea816-487-TE0841-02-31I21-A | Trenz Electronic GmbH |
IC MODULE
| 967
| Min.:1 Mult.:1 | - | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | ROHS3 Compliant | |
| TE0841-02-31I21-A | ||||||||||||||||||||
![]() | Mfr.TE0745-02-30-2ITwicea816-487-TE0745-02-30-2I | Trenz Electronic GmbH |
IC MODULE CORTEX-A9 1GB 64MB
| Min.:1 Mult.:1 | - | -40°C~85°C | TE0745 | 2.05 x 2.99 52mmx76mm | Obsolete | 1 (Unlimited) | B2B | - | 1GB | ARM® Cortex®-A9 | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) | - | ||
| TE0745-02-30-2I | ||||||||||||||||||||
![]() | Mfr.TE0803-02-04EG-1E3Twicea816-487-TE0803-02-04EG-1E3 | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4EG-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-02-04EG-1E3 | ||||||||||||||||||||
![]() | Mfr.TE0803-03-3BE11-ASTwicea816-487-TE0803-03-3BE11-AS | Trenz Electronic GmbH |
MODULE SOM TE0803-03
| Min.:1 Mult.:1 | - | - | - | - | Active | Not Applicable | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| TE0803-03-3BE11-AS | ||||||||||||||||||||
![]() | Mfr.TE0803-02-04EV-1E3Twicea816-487-TE0803-02-04EV-1E3 | Trenz Electronic GmbH |
IC MODULE ZYNQ USCALE 2GB 128MB
| Min.:1 Mult.:1 | - | 0°C~85°C | TE0803 | 2.05 x 2.99 52mmx76mm | Obsolete | Not Applicable | B2B | - | 2GB | Zynq UltraScale+ XCZU4EV-1SFVC784E | MPU Core | 128MB | - | - | ||
| TE0803-02-04EV-1E3 |
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